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dicing

英 [ˈdaɪsɪŋ]

美 [ˈdaɪsɪŋ]

v.  将(肉、菜等)切成小方块; 将…切成丁
dice的现在分词

计算机

柯林斯词典

  • 骰子;色子
    Adiceis a small cube which has between one and six spots or numbers on its sides, and which is used in games to provide random numbers. In old-fashioned English, 'dice' was used only as a plural form, and the singular wasdie, but now 'dice' is used as both the singular and the plural form.
    1. 掷骰子游戏
      Diceis a game which is played using dice.
      1. VERB 把(食物)切成小块;将…切丁
        If youdicefood, you cut it into small cubes.
        1. Dice the onion...
          把洋葱切成丁。
        2. Add the crushed garlic and remaining diced vegetables.
          加入捣碎的大蒜和剩余的蔬菜丁。

      双语例句

      • The Technology Study on UV Laser Dicing High Brightness LED Wafer
        高亮度LED晶圆紫外激光划片技术研究
      • The Experimental Research of Sapphire Dicing by a UV Laser
        紫外激光划切蓝宝石晶圆的试验研究
      • Study on Mechanism and Driving Error of θ Axis for the Abrasive Dicing Saw
        砂轮划片机θ向机构和传动误差分析
      • Upon the installation of a multi beam laser dicing system, the obviously advantages of using such a laser dicing process become evident.
        基于已经安装的多光束激光划片系统,其显著的优点已经得到证实。
      • In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
        本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。
      • We are dicing for drinks.
        我们在掷骰子赌喝酒。
      • Just like tags for requirements, categories of your test cases can be invaluable for slicing and dicing your testing data so that you can determine what's really happening.
        就像对于需求的标签一样,测试用例的范畴对于切割测试数据以便决定到底发生了什么来说是无价的。
      • I'm dicing. I'm dicing. I don't hear anything.
        我切我切切切,我啥也没听到。
      • Introduces the development of semiconductor industry, the characteristic of laser wafer dicing technology, the structure of laser wafer dicing machine, and the application in the production.
        介绍了半导体行业的发展,晶圆激光划片技术的特点、激光划片系统的组成与其在实际过程中应用。
      • Experimental Research on Improving Properties of Composite Electroplated Diamond Dicing Blade
        提高复合电沉积金刚石切割片性能的试验研究